KeyW is a total solutions provider for the Intelligence Community, solving their toughest challenges. We support the collection, processing, analysis and dissemination of information across the full life cycle of the Intelligence Community’s mission. We employ and challenge the most talented professionals in the industry with solving such complex problems as preventing cyber threats, transforming geospatial imaging into intelligence, and combating global terrorism.
The KeyW Engineering Development and Special Projects Division (EDSP) develops hardware solutions and products for the Intelligence Community and DoD missions. This includes hardware products related to the Signals Intelligence (SIGINT) mission, Tagging, Tracking, & Locating (TTL) mission, special communications technologies such as software defined radios (SDRs), and Electronics Packaging.
The field of Electronic Packaging is best defined as mechanical engineering of electronic systems. It involves the mechanical design of electronics through 4 levels including die, component, board, and chassis/cable. Within the design discipline, a mechanical engineer will use knowledge in heat transfer, structural mechanics, materials properties, general engineering design principles, geometric tolerance methods, and mechanically and electrically driven failure mechanisms. Many electronics must operate in extreme conditions such as in airplanes, satellites, ships, oil well drilling systems, and automobile engine compartments where they are exposed to extreme temperatures, thermal shock, vibration, structural shock, moisture, corrosion, and other environmental conditions. Thermal analysis techniques such as 1D thermal resistance modeling, finite difference method, or finite element methods are used to build models that analyze and optimize heat dissipation. Vibration and structural shock analysis is performed utilizing finite element software to calculate structural magnification factors and derive internal stresses to determine if the devices will survive the operating environment and the device lifetime. In selection of materials, it is important to consider material compatibility, weight, thermal performance, strength, cost, and any special processes required to manufacture or assemble.
All activities will be designed to give the intern a full understanding of the engineering design lifecycle and insight into the role that Mechanical Engineers play at KeyW. To facilitate their education and the quality of their experience each intern will be paired one-on-one with a mentor of the same discipline.
Intern will support electronics packaging design and manufacturing activities. Tasking may include:
Skills and Qualifications:
Required Availability: Full-time 6-month spring and summer internship
KeyW is an EEO employer. We are committed to providing fair and equal employment consideration, regardless of race, color, religion, national origin, gender, sexual orientation, age, marital status or disability.
How to Apply? Please click apply on the right.