KEYW Corporation

  • Electronics Packaging Engineer

    Job Locations 2 months ago(3/13/2018 11:50 AM)
    ID
    2018-17591
    # of Openings
    1
    Posted Date
    Engineering
    Default: Location : Location
    US-MD-Severn
    Job Locations
    US-MD
  • Overview

     

    We are seeking to hire an Electronics Packaging Engineer to join our team!  Our division is a small subset (<100) of the company comprised of engineers of various disciplines organized into product development teams. This small company atmosphere provides the perfect opportunity to demonstrate your engineering skills on the most challenging problems while also expanding your skills and advancing your career. If you are a highly motivated engineer who enjoys a challenging and dynamic environment where your contributions to a small team are both critical and valued, this company will provide you the tools and opportunity to flourish (and have some fun while you are at it).

     

    Responsibilities

     

     

    • Design ruggedized electronics assemblies, enclosures, and chassis for space and military applications utilizing Solidworks.
    • Optimize thermal performance, structural performance, material compatibility, and reliability utilizing engineering analysis and optimization techniques.
    • Review electronics packaging designs as they progress through development, qualification, and production considering design for manufacturability, yield issues, and reliability.
    • Develop engineering qualification plans for requirements verification and risk reduction utilizing a combination of engineering analysis and environmental testing (Thermomechanical, Shock/vibe, humidity, other fatigue tests, and overstress testing)..

     

     

    Qualifications

     

    Required:

     

    • Bachelor’s degree in mechanical engineering or similar degree with 5+ years of experience in mechanical packaging of electronics.
    • Familiarity with printed wiring board (PWB) fabrication, and electronics assembly processes.
    • Experience with design for manufacturability.
    • Experience resolving qualification and production failures.
    • Experience performing mechanical analysis including structural, thermal, or vibration.
    • Ability to select appropriate materials for interfaces and interconnects in electronic packages such as die attach, die encapsulation material, thermal interface materials, solder types, connectors, and adhesive attachment for components.

     

    Preferred:

     

    • MSME with concentration in Electronics Packaging Design, Electronics Process Development, or Structural/Thermal Analysis.
    • FEA experience in ANSYS.

     

    About the Organization

     

    KeyW is a pure-play national security solutions provider for the Intelligence, Cyber and Counterterrorism Communities' toughest challenges. We support the collection, processing, analysis and dissemination of information across the full spectrum of their missions. We employ and challenge more than 2,000 of the most talented professionals in the industry with solving such complex problems as preventing cyber threats, transforming data into intelligence and combating global terrorism.

     

    KeyW, together with its direct and indirect subsidiaries, encourages and actively supports a policy of Equal Employment Opportunity and commits to provide equal opportunity to everyone, regardless of race, color, religion, gender, sexual orientation, age, national origin or ancestry, marital status, veteran status, disability or any other classifications protected by Federal, State or local law. In fact, we foster an environment that promotes diversity, balance and fun—because we believe in the importance of having a workplace as unique as the challenges we solve.

     

     

    Clearance

     

     

    Must be willing and able to obtain a security clearance.

     

     

     

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