KeyW is a pure-play national security solutions provider for the Intelligence, Cyber and Counterterrorism Communities' toughest challenges. We support the collection, processing, analysis and dissemination of information across the full spectrum of their missions. We employ and challenge more than 2,000 of the most talented professionals in the industry with solving such complex problems as preventing cyber threats, transforming data into intelligence and combating global terrorism.
The KEYW Engineering Development and Special Projects Division (EDSP) develops hardware solutions and products for the Intelligence Community and DoD missions. This includes hardware products related to the Signals Intelligence (SIGINT) mission, Tagging, Tracking, & Locating (TTL) mission, and special communications technologies such as software defined radios (SDRs).
The Engineering Development and Special Projects (EDSP) divisions is hiring a Mid-Level Mechanical Engineer with strong experience in electronics packaging. Engineer will support design, qualification, testing, evaluation, and process development for fabrication of miniaturized electronic packages including Multi-Chip Modules (MCMs), FC-BGAs, hand-held TTL devices, and other high density electronic systems.
Degree: BS Mechanical Engineering from an ABET accredited Engineering College or University
Clearance: Must have the ability to obtain a security clearance
Location: Severn MD
Clearance Requirement: This position requires a Top Secret/SCI security clearance, based on current background investigation (SBI), as well as the favorable completion of polygraph. Clearance and polygraph processing will be completed by the U.S. Government.
KeyW is an EEO employer. We are committed to providing fair and equal employment consideration, regardless of race, color, religion, national origin, gender, sexual orientation, age, marital status or disability.
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