KEYW Corporation

Mechanical Engineer

2 months ago
# of Openings


KeyW is a pure-play national security solutions provider for the Intelligence, Cyber and Counterterrorism Communities' toughest challenges. We support the collection, processing, analysis and dissemination of information across the full spectrum of their missions. We employ and challenge more than 2,000 of the most talented professionals in the industry with solving such complex problems as preventing cyber threats, transforming data into intelligence and combating global terrorism.


The KEYW Engineering Development and Special Projects Division (EDSP) develops hardware solutions and products for the Intelligence Community and DoD missions.  This includes hardware products related to the Signals Intelligence (SIGINT) mission, Tagging, Tracking, & Locating (TTL) mission, and special communications technologies such as software defined radios (SDRs).


The Engineering Development and Special Projects (EDSP) divisions is hiring a Mid-Level Mechanical Engineer with strong experience in electronics packaging. Engineer will support design, qualification, testing, evaluation, and process development for fabrication of miniaturized electronic packages including Multi-Chip Modules (MCMs), FC-BGAs, hand-held TTL devices, and other high density electronic systems.



  • Use 3D CAD Design Software (Solidworks) to perform mechanical design of electronic systems with optimization of packaging density, material compatibility, thermal performance, structural performance, and reliability. The engineer will understand and mitigate possible failure mechanisms associated with the materials, interconnects, and environmental loads to develop a reliable design.
  • Develop and execute mechanical qualification plans for electronics designs including thermo-mechanical testing, vibration testing, drop testing, humidity testing, and other types of fatigue and/or overstress tests.
  • Selection and qualification of electronic materials to be used in high density electronics assemblies
  • Design, process development, and qualification of novel interconnect structures to reach highest density possible electronic designs
  • Development of new assembly technologies which may include welding, soldering, sintering, lamination, encapsulation/molding, machining, or other types of electronics assembly techniques
  • Supervise and mentor junior level mechanical engineers


Required Skills:

  • 5-10 years of experience in electronic packaging design or process development
  • Strong work ethic with a track record of completing tasks on schedule
  • Hands on experience with assembly processes, manufacturing, and equipment
  • Experience designing for manufacturability of low to medium volume products
  • Experience planning and executing DoE
  • Experience supervising and mentoring engineers, designers, or technicians

Desired Skills:

  • MS Mechanical Engineering or MS Materials Science with a concentration in electronics system design, manufacturing, structural/thermal analysis, or electronics reliability
  • Experience with over-molded laminate module packaging processes including: wire bonding, die attach, flip chip assembly, molding, SMT
  • Knowledge of electronic materials used in lamination, wire bonding, soldering, molding, plating, interconnects
  • Knowledge of electronic interconnect and component failure mechanisms and mitigation techniques
  • Experience with mechanical failure analysis of electronic systems
  • Possess active security clearance


Degree: BS Mechanical Engineering from an ABET accredited Engineering College or University


Clearance: Must have the ability to obtain a security clearance


Location: Severn MD


Clearance Requirement: This position requires a Top Secret/SCI security clearance, based on current background investigation (SBI), as well as the favorable completion of polygraph.  Clearance and polygraph processing will be completed by the U.S. Government.


KeyW is an EEO employer. We are committed to providing fair and equal employment consideration, regardless of race, color, religion, national origin, gender, sexual orientation, age, marital status or disability.


How to Apply?

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